Pre-packaged Power Devices for PCB Embedded Power Electronics (P3EP)

Date: 01.01.2022

Topics: Gallium Nitride, Power Electronics

Project summary

Project details

Total project cost: £3,450,367

Funder: UKRI (Industrial Strategy Challenge Fund)

Start date: 02/01/2022

Partners: Pulse Power and Measurement; The Thinking Pod Innovations; Cambridge GaN Devices; RAM Innovations; Cambridge Microelectronics; CSA Catapult

P3EP (Pre-packaged Power Devices for PCB Embedded Power Electronics) aims to develop a UK supply chain for PCB-embedded power systems with gallium nitride (GaN) devices.

The project will provide a supply chain that will allow manufacturers across the power electronics, machines and drives (PEMD) industry to build converters with the highest power densities.

Wide bandgap power devices such as GaN offer extremely high switching speeds and the possibility to significantly reduce system size.

However, this can only be exploited with new packaging and module construction methods that increase thermal transfer and reduce parasitic effects.

The emerging technology of embedding power devices into the PCB has proven to be the most advanced way to achieve this goal, which will be exploited in the P3EP project.

The P3EP manufacturing chain is based on GaN pre-packages, which have major advantages over bare dies because they allow production testing, characterisation, and reliability qualification.

This improves yield, cost, and time-to-market for the PEMD system.

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