(Webinar) An Essential Guide to Packaging Technology: Essential Packaging Processes

15th July 2020
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Date(s) - 15/07/2020
10:00 am - 11:00 am


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Series overview:

CSA Catapult is pleased to present this four-part, weekly webinar series which will cover the essentials of Semiconductor packaging technology. The webinars, led by Andy Longford, will allow participants to gain a thorough insight into the wide range of technological developments, that are currently involved in this industry sector and are enabling future innovations.

An Essential Guide to Packaging Technology will take an in-depth look at the following areas:

Part 1: Evolution of chip packaging

Part 2: Packaging the (CS) applications

Part 3: Essential Packaging processes

Part 4: Advanced Packaging Trends

An Essential Guide to Packaging Technology: Essential Packaging processes

Wed 15/07/20

In order to provide a better understanding of the chip packaging capability, the third instalment of this essential guide series will see Andy explain what is involved in the different build and assembly processes steps.

Presenter: Andy Longford C.Eng FIET Packaging Strategy Advisor– CSA Catapult

Andy Longford has been working in the Semiconductor Packaging and Assembly industry for over 30 years, involved in package design, development and assembly projects including LED, MEMS and Power devices, for applications in Automotive, industrial and Consumer products, as well as Aerospace and Defence related products. He has authored over 30 technical papers on Electronics Interconnect, Chip Packaging and Lead-Free electronics developments, with 15 technical articles published and numerous presentations made at conferences worldwide. He is an EPSRC College peer review member, a registered EU Research Project evaluator and has served on a number of UK Government technical committees. His role at the Catapult is to support the Advanced Packaging team with strategic planning, technology training and roadmap development


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