Thermal Management in High Performance Electronics Packaging (Part 1)

12th August 2020
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Date(s) - 12/08/2020
10:00 am - 11:00 am


Following the success of An Essential Guide to Packaging Technology, CSA Catapult is pleased to deliver this two-part webinar series on Thermal Management in High Performance Electronics Packaging, presented by Callum Middleton, Materials Engineer at CSA Catapult.

Part one: An Introduction to Heat Transfer and its Impact on Microelectronics

The first webinar in this series will look at the basics of heat transfer: the fundamental physics and how this background knowledge informs the design of thermally efficient packages. Callum will discuss how the physics impacts the correct choice of material and how we apply this knowledge in Multiphysics simulations of our structures at CSA Catapult.

Click here to register your place at the webinar.

Speaker bio:

Callum Middleton:

Callum works as a Materials Engineer at the CSA Catapult, where he is responsible for sourcing and testing novel materials for advanced packages. He is also responsible for thermal design within advanced packages, utilising his experience from his PhD, obtained from the University of Bristol. This work focused specifically on the materials science of compound semiconductors, and how to optimise heat flow in compound semiconductor devices to ensure these components can have their full potential realised.

Please note, this webinar will be recorded.