Thermal Management in High Performance Electronics Packaging (Part 2)

19th August 2020
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Date(s) - 19/08/2020
10:00 am - 11:00 am


Following the success of An Essential Guide to Packaging Technology, CSA Catapult is pleased to deliver this two-part webinar series on Thermal Management in High Performance Electronics Packaging, presented by Callum Middleton, Materials Engineer at CSA Catapult.

Part two: Utilising Temperature Measurements and Simulations in Advanced Package Design

The second webinar in this series will discuss thermal simulations and comparisons to measurements. Callum will introduce the different ways of measuring temperature in electronic devices, detailing the advantages of each technique. Callum will explain how results can be related to Multiphysics simulations. This can be either through calibrated the simulation or working with the simulation to determine unknown material parameters.

Click here to register your place at the webinar.

Speaker bio:

Callum Middleton:

Callum works as a Materials Engineer at the CSA Catapult, where he is responsible for sourcing and testing novel materials for advanced packages. He is also responsible for thermal design within advanced packages, utilising his experience from his PhD, obtained from the University of Bristol. This work focused specifically on the materials science of compound semiconductors, and how to optimise heat flow in compound semiconductor devices to ensure these components can have their full potential realised.

Please note, this webinar will be recorded.