Catapults

P3EP: Creating a UK supply chain for embedded PCB power electronics systems

Date: 23.07.2025

Topics: Net Zero, Power Electronics

Front view of a commercial airplane on the runway, with engines, landing gear, and security measures visible under a blue sky. - CSA Catapult

P3EP

Wide bandgap (WBG) power devices offer high switching speeds and reduced system size and weight across a wide range of applications. 

To meet the growing demand for power-dense converters in harsh environments, power electronics, machines and drives (PEMD) manufacturers must build converters with the highest power densities. However, traditional assembly methods are limited in their ability to meet these needs. 

P3EP (Pre-packaged Power Devices for PCB Embedded Power Electronics), a £3.4 million project funded by Innovate UK, set out to solve this challenge by delivering the world’s first complete supply chain for embedded power electronics products based on pre-packaged high-voltage (HV) gallium nitride (GaN) devices—enabling UK power semiconductor companies to enter new markets. 

The challenge

Although the UK has world-leading expertise in power electronics, there is currently no domestic manufacturing line for assembling embedded power electronics. 

Globally, high-level integration for high-density power modules using compound semiconductors is being pursued to deliver smaller, lighter, and more efficient power electronics solutions. 

Close-up view of a blue-toned electronic circuit board highlighting microchips and security-focused components. - CSA Catapult

The approach

Led by Pulse Power and Measurement, the project designed and packaged an embedded GaN device suitable for automotive applications. 

CSA Catapult’s power electronics lab at the Innovation Centre in Newport enabled thermo-electric characterisation and reliability testing.  

The Catapult also engaged with industry stakeholders to share project developments with potential UK customers who could benefit from the technology. 

The outcome

P3EP delivered a wide range of technical and economic benefits for the project partners:

RAM developed equipment that meets the requirements for compact, embedded solutions and offers optimised manufacturing processes to customers worldwide

Cambridge GaN Devices launched a new business unit focused on high-power and pre-packaged devices, now accounting for 25% of the company. This unit provides design and application support for demanding, high-margin applications

Pulse Power and Measurement reduced time-to-market for power-dense converters using embedded GaN

The Thinking Pod Innovations developed a converter design that can be rapidly adopted. Future iterations will benefit significantly from the manufacturing techniques developed in this project, reducing costs and accelerating time-to-market

Cambridge Microelectronics enhanced the value of its services through expertise in HV semiconductor optimisation and testing, which is expected to attract new customers and increase revenue

The project created 44 new jobs and has the potential to create 28 more over the next three years. This project has significant potential to benefit other UK WBG semiconductor companies. Its state-of-the-art packaging technology can unlock the full potential of their chips, open new market opportunities, and provide faster routes to commercialisation.

First of its kind

P3EP delivered an easy-to-use platform for power electronics manufacturers to bring the most demanding embedded assemblies to market—enabling the creation of energy-efficient, power-dense devices that were previously unattainable.

Establishing a UK supply chain

Project partners developed the design and toolchain for embedded power converters and used pre-packaged GaN modules to demonstrate assembly for PEMD systems.

Re-shoring manufacturing capabilities

P3EP established UK production capability for custom GaN pre-packages that protect the die and optimise multi-chip module performance—both electrically and thermally. Re-shoring manufacturing to the UK will boost exports of high-value products.

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