Catapults

Advanced packaging process engineer from CSA Catapult selected to join international researcher forum in the Republic of Korea

Date: 30.07.2025

Topics: AI, Quantum

International Semiconductor Researchers Forum in the Republic of Korea. - CSA Catapult

Process design engineer Meghna De from CSA Catapult’s advanced packaging team recently returned from the International Semiconductor Researchers Forum, hosted in the Republic of Korea.

Meghna was one of only ten delegates to be invited by the Department for Science, Innovation and Technology (DSIT) to attend the international forum based on her compound semiconductor assembly and integration.

A large group at the International Semiconductor Researchers Forum pose and smile in a conference room, many giving thumbs-up gestures. - CSA Catapult
Modern glass office building, the National Nanofab Centre in Daejon, with Korean signage, trees, cars, and a blue sky. - CSA Catapult

“It was a privilege to participate in the 2025 International Semiconductor Researchers Forum as part of the UK delegation.

“I’m thankful to DSIT for coordinating this impactful initiative, which served as a dynamic platform for international engagement and future-focused dialogue.

“The forum offered an exceptional opportunity to exchange ideas with global experts, explore avenues for collaborative innovation on Heterogeneous Integration, and represent the strength of UK research within the international semiconductor community.

“This is a career highlight for me and reinforces the importance of cross-border partnerships in shaping the future of semiconductor technologies.”

Meghna De, process design engineer

“I’m absolutely delighted about Meghna’s selection to join the prestigious International Researcher Forum in the Republic of Korea. It’s a true testament to her talent, passion for innovation, and relentless pursuit of excellence.

“Her participation in this global forum highlights the innovative work happening at CSA Catapult and the growing international recognition of our contributions to advanced packaging. We’re all looking forward to the insights and inspiration she’ll bring back to help shape our research.”

Dr Jayakrishnan Chandrappan, head of packaging