Date: 29.01.2020
Compound Semiconductor Applications (CSA) Catapult has appointed its new Head of Advanced Packaging, Dr. Jayakrishnan Chandrappan.
Dr. Jay’s appointment as Head of Advanced Packaging follows shortly after joining the Catapult as a Principal Engineer in 2019. With over 20 years of international experience in industry and industrial research, Jay’s expertise ranges from material engineering, microelectronics, advanced packaging, reliability and testing. Prior to joining the team at CSA Catapult, Jay’s career includes roles at companies such as Center for Process Innovation, Global Foundries Inc., Institute of Microelectronics, A-Star Singapore, and as a Marie-Curie fellow at the University of Leeds. He is a recipient of Europe’s most prestigious Marie-Skłodowska-Curie fellowship and won the Royal Society of Chemistry ‘Emerging Technology Showcase’ award in 2015.
Commenting on his new role, Dr. Jay says: ‘The CSA Catapult Advanced Packaging team aims to provide innovative system integration solutions to support next-generation technologies. I am excited to begin work in this cutting-edge technology area to help provide leading solutions for markets such as smart automotive transportation, clean energy, digital communications and security and defence. With a combination of our teams’ expertise in Power Electronics, RF, Photonics and Advanced Packaging, the Catapult has a pivotal role to play to help the UK reach future technology trends.’
CTO at CSA Catapult, Martin McHugh, says: ‘I’m pleased to welcome Jay as the new Head of Advanced Packaging at the Catapult. This appointment comes at an important time for the business. We have grown a talented team of 70+ employees who are working on some of the UK’s biggest projects. With Jay on board as Head of Advanced Packaging, he will be leading his team through packaging design, process development, assembly and testing in this area of the business.’
To learn more about CSA Catapult, click here.
