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Advanced packaging

Providing cutting-edge packaging solutions unique to the UK

We are experts in the design, modelling, assembly, integration and testing of advanced packages for semiconductor and compound semiconductor devices. 

Our in-depth knowledge and state-of-the-art equipment help transform proof-of-concept ideas and prototypes into robust, reliable and efficient devices that perform to their full potential. 

Our multidisciplinary team has the know-how and skills to provide bespoke and tailormade solutions for your applications. 

Working in close collaboration with our radio frequency (RF) and microwave communications, power electronics and photonics teams, we provide a level of knowledge and understanding of technology-specific requirements that cannot be found anywhere in an open-access setting in the UK.  

Jayakrishnan Chandrappan

head of advanced packaging

“At its very core, advanced packaging is about getting a chip to perform to the best of its ability. 

“The package provides electrical interconnects, thermal management and protects the chip from damage. Without a robust and reliable package, semiconductor devices simply do not work."

Package design and modelling

We provide access to sophisticated design, simulation and modelling tools to help speed up the prototyping process and optimise the performance of your device. 

Our multiphysics simulation tools provide highly accurate models of package architecture parameters, such as mechanical, electrical and thermal, enabling us to fully optimise the package performance with reduced size and enhanced reliability.  

Our Design for Manufacturing (DFM) approach ensures that products can be manufactured quicker and in a more cost-effective way.  

 Capabilities: 

  • Multiphysics simulation 
  • Package architecture optimisation 
  • Power and signal integrity optimisation  
  • Thermal management 
  • Additive manufacturing process design 

Package assembly

We provide a comprehensive assembly process using the latest tools, techniques and materials that allows you to verify your designs, from proof-of-concept to prototyping.

We provide open access, state-of-the-art assembly equipment.

We have extensive experience of bonding techniques, enabling us to provide novel solutions to shrinking architectures, chip complexity and more dense interconnects.

01 | 03

Die bonding

Capabilities: 

  • Advanced die attach – silver and copper sintering 
  • Flip chip bonding 
  • Epoxy die bonding 
  • Solder paste die bonding 
  • Fluxless soldering 
  • Eutectic die bonding 
  • Fluid dispensing and jetting 
  • High accuracy automatic multi-purpose bonder 

 

 Characterisation tools: 

  • Multifunction material tester (pull, ball shear, die shear) 
  • Optical tensiometer surface analysis 
  • High-resolution optical inspection 
  • X-ray imaging with CT scanning 

 

02 | 03

Wire bonding

Capabilities: 

  • 3D chip stacking 
  • Multi-purpose wire bonding (heavy wire, fine wire, wedge-wedge and ball-wedge) 
  • Clip and ribbon bonding 

03 | 03

Hybridisation

We are the UK's first open-access facility with a sub-10 µm hybridisation capability and are one of only a handful of facilities in the world with this capability. 

This innovative process enables the 3D integration of two or more semiconductor dies through vertical interconnects, which is vital for converging diverse technologies in a package. This allows us to make interconnect lengths shorter, enhance signal and power integrity and reduce the size of the package. 

We provide a complete suite of hybridisation capabilities, from design and modelling to prototyping and process scale-up. 

Capabilities: 

  • 2.5 and 3D multi-chip packaging 
  • Flip chip interconnect – Au/Sn micro bump assembly 
  • Adhesive, soldering, thermocompression and ultrasonic bonding techniques 
  • UHD vision alignment 
  • Integrated scrubbing with formic acid cleaning 
  • Epoxy and sinter die attach 

Thermal management

We are experts in thermal management and can develop novel solutions to address potential device or system failures caused by high temperatures. 

We provide a complete suite of capabilities and equipment, from design and thermal modelling to rapid prototyping and testing, for the thermal management of electronic devices. 

We provide access to multi-material and ceramic 3D printing equipment, unique to the UK, that can quickly prototype novel packages with high thermal conductivity for higher power and performance. We have a picosecond laser dicing and micromachining system that can dice semiconductor wafers and package materials. This equipment is part of our DER-IC lab.

Capabilities:  

  • Rapid prototyping (3D CAD, 3D printing)  
  • Metal, ceramic and multi-material 3D printing 
  • Sintering and debinding 
  • Laser dicing and micromachining 
  • Thermal conductivity/diffusivity/specific heat measurement 
  • Thermal imaging   

Testing and validation

We work in close collaboration with our power electronics, RF and microwave communications, and photonics teams on the testing and validation of devices.  

Our experts have the specialist knowledge of industry-specific requirements and performance metrics to optimise your devices for their intended applications.   

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Our expertise

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Power electronics

Power electronics

Our world-leading team of experts has the know-how, experience and track record in developing and commercialising high-performing power electronics devices for automotive, energy and industrial applications.

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RF & microwave communications

RF & microwave communications

Our radio frequency and microwave communications experts help optimise the performance and improve the energy efficiency of RF and microwave devices in future telecoms, space, defence and security industries.

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Photonics

Photonics

We are experts in the design, modelling, characterisation and validation of photonics devices, from laser emitters to photonic integrated circuits and quantum hardware.

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Advanced packaging

Advanced packaging

We provide a unique capability in advanced packaging for UK industry. We deliver bespoke solutions to the many complexities associated with compound semiconductor devices.

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Get in touch

To learn more about how we can work together, get in touch with a member of our team today.

Contact us