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RF & microwave communications

Delivering a resilient network for the UK

Our radio frequency (RF) and microwave communications experts advance the development of cutting-edge applications across the telecoms, space, defence and security industries. 

We can support you in the design, testing and validation of your product, helping to improve the energy efficiency of your devices whilst ensuring high data speeds, low latency and increased bandwidth.  

Our team of experts is complemented by CSA Catapult’s advanced packaging team, providing you with a comprehensive suite of capabilities unique to the UK. 

Joe Gannicliffe

head of RF and microwave communications

“Our lives are now completely reliant on the high-speed transfer of data from one place to another. From remote working to HD streaming and online banking, we are generating more and more data each day and putting an increasing strain on our telecoms network."

Design and modelling

We help develop more accurate models of the electrical, thermal and electromagnetic behaviour of your devices, packages or modules. 

Our sophisticated modelling and simulation tools dramatically reduce the risk of unexpected behaviour in devices, creating better designs and giving you a more cost-effective, high- performing product that can be brought to market quicker.  

Capabilities

  • EM simulation
  • Thermal modelling
  • RF GaN PA design
    • Discrete/MMIC
    • L - Ka band, mW to kW power range
    • Doherty & LMBA architectures
  • Software tools include: Keysight ADS, Keysight SystemVue & Ansys

Characterisation

We help improve the efficiency, performance and lifetime of your wafer, PCB or device by providing detailed information about how it performs under a range of operating conditions and environments.  

We provide accurate and detailed information about the performance of your product through state-of-the-art testing equipment, helping you to determine the optimal operating conditions and circuitry of your device.    

Capabilities:

  • Load pull measurements
    • Over temperature - 1.8 - 27.5GHz
    • Room temperature - 10 – 67GHz
    • 2-tone load pull measurement capability
  • Linearity measurements & DPD capability to 43.5GHz

Integration

We help design and build the optimal package for your device by providing access to our advanced packaging experts. 

Our advanced packaging team offers a comprehensive suite of capabilities unique to the UK, combined with specialist knowledge in the latest cutting-edge techniques and materials. 

Through the delivery of a bespoke, customer-led packaging solution, we optimise devices that reduce losses, maintain signal integrity and offer reliable protection.  

Capabilities

  • High-frequency RF chip packaging
  • MMIC assembly and low-loss interconnects

Validation

Our comprehensive evaluation capabilities ensure your device is performing to the required standards, and is compatible and compliant with the existing telecoms networks. 

We can test against industry standards or specific requirements and performance metrics, giving you full confidence in the reliability and lifetime of your device and its tolerance to harsh conditions. 

Capabilities:

  • RF life test
  • S-parameters
  • Power amplifier testing

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Future Telecoms Hub

Our Future Telecoms Hub helps companies test, develop and improve their technologies through CSA Catapult’s expertise across Net Zero, RF and microwave communications, photonics and quantum technologies. 

Our expertise

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Power electronics

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RF & microwave communications

RF & microwave communications

Our radio frequency and microwave communications experts help optimise the performance and improve the energy efficiency of RF and microwave devices in future telecoms, space, defence and security industries.

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Photonics

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We are experts in the design, modelling, characterisation and validation of photonics devices, from laser emitters to photonic integrated circuits and quantum hardware.

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Advanced packaging

Advanced packaging

We provide a unique capability in advanced packaging for UK industry. We deliver bespoke solutions to the many complexities associated with compound semiconductor devices.

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Get in touch

To learn more about how we can work together, get in touch with a member of our team today.

Contact us