Multiphysics simulation of RF modules over integrated mechanical, electrical & thermal test scenarios to get first time right prototypes.
Multiphysics simulation of RF modules over integrated mechanical, electrical & thermal test scenarios to get first time right prototypes.
Integrated circuit characterization & analysis enbling accurate semiconductor models of wafers, die, device, & module that enable system level design.
Robust & reliable circuit, PCB & system hardware design optimised for power & EMC, including using models from IC-CAP (above).
PCB design software with schematic capture and BOM generation facility, design & population with 3D models for functionally correct export directly to PCB manufacture.
Accelerated RF circuit design, linear and non-linear simulation capability, 2.5D EM simulation capability, RF layout design and export support, first time accurate and reliabile RF circuit design.