Advanced Packaging Design Studio

MCIV Diamond Logo

Modelling Equipment

COMSOL & Ansys

Multiphysics simulation of package modules over integrated mechanical, electrical, photonic & thermal test scenarios to get first time right prototypes.


3D mechanical design capture of packaging components and assemblies. Integrated with multiphysics software for an efficient design-simulation process.

Zuken CR-8000

Chip-Package-Board co-design for Power, Photonics, and RF.